Pni ASIC Instrukcja Użytkownika Pobierz pdf (Strona 19)

Recommended Processing Parameters

Figure 11: Lead Free Reflow Profile

Table 14 Recommended Processing Parameters

Reflow Parameter Temperature (°C) Time (sec)

Preheat Temperature (T

Smin

to T

Smax

) 150°C – 200°C 60-180

Temperature T

(typical solder melting point) >218°C

Smax

to T

Ramp-up Rate 3°C/second max

Peak Temperature T

260°C

Time 25°C to Peak T

6 minute max

Time Maintained Above Temperature T

) 218°C 60-120

Soak (time within 5° of actual Peak T

) 10-20

Ramp-down Rate 4°C/second max

a. Meets lead-free profile recommendations (IPC/JEDEC J-STD-020)

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Pni ASIC Instrukcja Użytkownika Strona 19