
RM3000 & RM2000 Sensor Suite User Manual r08 Page 19 of 41
Figure 3-18: Recommended Solder Reflow Profile
Table 3-6: Recommended Solder Processing Parameters
1
Preheat Temperature, Minimum
Preheat Temperature, Maximum
Preheat Time (T
Smin
to T
Smax
)
Ramp-Up Rate (T
Smax
to T
L
)
Time from 25°C to Peak (T
P
)
Soak Time (within 5°C of T
P
)
Footnote:
1. Meets IPC/JEDEC J-STD-020 profile recommendations. Sen-XY and Sen-Z
classified as moisture sensitivity level 1. 3D MagIC classified as moisture
sensitivity level 3.
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